triquint semiconductor texas: phone (972)994-8465 fax (972)994-8504 email: info-mmw@tqs.com web: www.triquint.com advance product information september 16, 2004 1 note: devices designated as epu are typically early in their characterization process prior to finalizing all electrical and pr ocess specifications. specifications are subject to change without notice -25 -20 -15 -10 -5 0 5 10 15 20 25 25 26 27 28 29 30 31 32 33 34 35 frequency (ghz) s-parameter (db) product description the triquint TGA4902-EPU-SM is a ka-band packaged medium power amplifier. the tga4902-sm operates from 25-35 ghz and is designed using triquints proven standard 0.25 um power phemt production process. the TGA4902-EPU-SM typically provides 25 dbm of output power at 1 db gain compression, with small signal gain of 18 db. the TGA4902-EPU-SM is ideally suited for vsat ground terminal market, point-to-point radio, point-to-multipoint communications. evaluation boards are available. primary applications ? ka-band vsat ? point-to-point radio ? point-to-multipoint communications ka-band packaged mpa TGA4902-EPU-SM preliminary measured data bias conditions: vd = 6 v, id = 220 ma, tuned orl gain irl key features ? typical frequency range: 25 - 35 ghz ? 25 dbm nominal p1db ? 18 db nominal gain ? bias 6 v, 220 ma ? package dimensions: 4.0 x 4.0 x 0.9 mm 15 17 19 21 23 25 27 25 26 27 28 29 30 31 32 33 34 35 frequency (ghz) p1db (dbm)
triquint semiconductor texas: phone (972)994-8465 fax (972)994-8504 email: info-mmw@tqs.com web: www.triquint.com advance product information september 16, 2004 2 note: devices designated as epu are typically early in their characterization process prior to finalizing all electrical and pr ocess specifications. specifications are subject to change without notice TGA4902-EPU-SM table i maximum ratings 1/ symbol parameter value notes vd drain voltage 8 v 2/ vg gate voltage range -5 to 0 v id drain current 296 ma 2/ 3 / ? ig ? gate current 8.8 ma 3/ p in input continuous wave power 20 dbm p d power dissipation see note 4/ 2/ t ch operating channel temperature 150 0 c5/ 6 / t m mounting temperature (30 seconds) 250 0 c t stg storage temperature -65 to 150 0 c t case package operating temperature -40 to 110 0 c 1/ these ratings represent the maximum operable values for this device. 2/ combinations of supply voltage, supply current, input power, and output power shall not exceed p d . 3/ total current for the entire mmic. 4/ for a median life time of 1e+6 hrs, power dissipation is limited to: p d (max) = (150 0 c C t base 0 c) / 60.71 ( 0 c/w) where t base is the base plate temperature. 5/ junction operating temperature will directly affect the device median time to failure (mttf). for maximum life, it is recommended that junction temperatures be maintained at the lowest possible levels. 6/ these ratings apply to each individual fet.
triquint semiconductor texas: phone (972)994-8465 fax (972)994-8504 email: info-mmw@tqs.com web: www.triquint.com advance product information september 16, 2004 3 note: devices designated as epu are typically early in their characterization process prior to finalizing all electrical and pr ocess specifications. specifications are subject to change without notice table ii electrical characteristics (ta = 25 0 c, nominal) TGA4902-EPU-SM parameter typical units frequency range 25 - 35 ghz drain operating 6 v quiescent current 220 ma small signal gain 18 db input return loss 15 db output return loss 10 db output power @ 1 db compression gain 25 dbm temperature coefficient -0.017 db/ 0 c table iii thermal information parameter test conditions t ch ( o c) r t jc ( q c/w) t m (hrs) r q jc thermal resistance (channel case) vd = 6 v i d = 220 ma pdiss = 1.32 w 150 60.71 1.0e+6 note: worst case condition with no rf applied, 100% of dc power is dissipated, case temperature @ 70 o c
triquint semiconductor texas: phone (972)994-8465 fax (972)994-8504 email: info-mmw@tqs.com web: www.triquint.com advance product information september 16, 2004 4 note: devices designated as epu are typically early in their characterization process prior to finalizing all electrical and pr ocess specifications. specifications are subject to change without notice 15 16 17 18 19 20 21 22 23 24 25 26 27 25 26 27 28 29 30 31 32 33 34 35 fre q uenc y ( ghz ) p1db (dbm) TGA4902-EPU-SM preliminary measured data bias conditions: vd = 6 v, id =220 ma, tuned 0 2 4 6 8 10 12 14 16 18 20 22 24 26 20 22 24 26 28 30 32 34 36 38 40 frequency (ghz) gain (db)
triquint semiconductor texas: phone (972)994-8465 fax (972)994-8504 email: info-mmw@tqs.com web: www.triquint.com advance product information september 16, 2004 5 note: devices designated as epu are typically early in their characterization process prior to finalizing all electrical and pr ocess specifications. specifications are subject to change without notice TGA4902-EPU-SM preliminary measured data bias conditions: vd = 6 v, id =220 ma -20 -18 -16 -14 -12 -10 -8 -6 -4 -2 0 20 22 24 26 28 30 32 34 36 38 4 0 frequency (ghz) input return loss (db) tuned * -20 -18 -16 -14 -12 -10 -8 -6 -4 -2 0 20 22 24 26 28 30 32 34 36 38 40 frequency (ghz) output return loss (db) tuned * * as build performance without tuning stubs
triquint semiconductor texas: phone (972)994-8465 fax (972)994-8504 email: info-mmw@tqs.com web: www.triquint.com advance product information september 16, 2004 6 note: devices designated as epu are typically early in their characterization process prior to finalizing all electrical and pr ocess specifications. specifications are subject to change without notice package pinout diagram TGA4902-EPU-SM pin description 1, 5, 6, 10, 11, 15, 16, 20, 21 gnd 2, 4, 7, 12, 14, 19 nc 3rf input 8vg1 9vg2 13 rf output 17 vd1 18 vd2 bottom view top view dot indicates pin 1 14 13 15 17 16 18 19 12 11 10 9 8 21 20 1 2 3 7 6 5 4
triquint semiconductor texas: phone (972)994-8465 fax (972)994-8504 email: info-mmw@tqs.com web: www.triquint.com advance product information september 16, 2004 7 note: devices designated as epu are typically early in their characterization process prior to finalizing all electrical and pr ocess specifications. specifications are subject to change without notice .65 .40 .30 0 0 0.70 0.90 1.35 3.10 4.00 3.10 0.90 2.2 x 2.2mm ground pad 21 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 20 19 18 17 16 0.55 mechanical drawing gaas mmic devices are susceptible to damage from electrostatic discharge. proper precautions should be observed during handling, assembly and test. TGA4902-EPU-SM units: millimeters. package tolerance: +/- 0.10 bottom view
triquint semiconductor texas: phone (972)994-8465 fax (972)994-8504 email: info-mmw@tqs.com web: www.triquint.com advance product information september 16, 2004 8 note: devices designated as epu are typically early in their characterization process prior to finalizing all electrical and pr ocess specifications. specifications are subject to change without notice TGA4902-EPU-SM recommended board layout assembly 100pf tuning 100pf 10 ohm 1 uf vg ~ -0.6v to get 220ma id tuning vd = 5-6v 1 uf 10 ohm
triquint semiconductor texas: phone (972)994-8465 fax (972)994-8504 email: info-mmw@tqs.com web: www.triquint.com advance product information september 16, 2004 9 note: devices designated as epu are typically early in their characterization process prior to finalizing all electrical and pr ocess specifications. specifications are subject to change without notice TGA4902-EPU-SM ordering information part package style TGA4902-EPU-SM qfn 4x4 surface mount assembly of a tga4902-epu surface mount package onto a motherboard 1. clean the motherboard or module with acetone. rinse with alcohol and di water. allow the circuit to fully dry. set hot plate to 210c. 2. to improve the thermal and rf performance, we recommend a heat sink attach to the bottom of the package and apply snpb or equivalent solder to the bottom of tga4902-sm. 3. apply flux # 5rma (product of indium corporation of america) to housing, pcb and base of tga4902-sm. put sn62 (product of indium corporation of america) between housing and pcb, housing and tga4902-sm. 4 set the whole fixture on the hot plate until the solder melts. after 5 or 6 seconds, carefully remove the fixture from the hot plate and that it cool down quickly. 5. clean the assembly with alcohol. high volume assembly of the package the TGA4902-EPU-SM can be a surface mounted with standard high volume assembly processes using a standard sn63 solder paste, such as kester r560. refer to kester r560 manufacture data sheet for recommended reflow profile, cleaning, and handling. dispense solder paste using standard solder printing techniques such as stencil solder printing. pick-and-place using a standard machine such as mrsi machine. perform solder reflow using a sikama reflow system. recommended solder stencil and motherboard interface layout are available upon request. to improve thermal and rf performance, it is recommend to maximize the number of vias on the mother board where the TGA4902-EPU-SM will be attached.
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